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opa171 opa2171 opa4171 www.ti.com sbos516c C september 2010 C revised june 2011 36v, single-supply, sot553, general-purpose operational amplifiers check for samples: opa171 , opa2171 , opa4171 1 features description the opa171, opa2171 and opa4171 (opax171) 2 ? supply range: +2.7v to +36v, 1.35v to 18v are a family of 36v, single-supply, low-noise ? low noise: 14nv/ hz operational amplifiers with the ability to operate on ? low offset drift: 0.3 v/ c (typ) supplies ranging from +2.7v ( 1.35v) to +36v ? rfi filtered inputs ( 18v). these devices are available in micro-packages and offer low offset, drift, and ? input range includes the negative supply bandwidth with low quiescent current. the single, ? input range operates to positive supply dual, and quad versions all have identical ? rail-to-rail output specifications for maximum design flexibility. ? gain bandwidth: 3mhz unlike most op amps, which are specified at only one ? low quiescent current: 475 a per amplifier supply voltage, the opax171 family is specified from ? high common-mode rejection: 120db (typ) +2.7v to +36v. input signals beyond the supply rails ? low input bias current: 8pa do not cause phase reversal. the opax171 family is stable with capacitive loads up to 300pf. the input ? industry-standard packages: can operate 100mv below the negative rail and within C 8-pin soic 2v of the top rail during normal operation. note that C 8-pin msop these devices can operate with full rail-to-rail input C 14-pin tssop 100mv beyond the top rail, but with reduced ? micro packages: performance within 2v of the top rail. C single in sot553 the opax171 series of op amps are specified C dual in vssop-8 from C 40 c to +125 c. applications ? tracking amplifier in power modules ? merchant power supplies ? transducer amplifiers ? bridge amplifiers ? temperature measurements ? strain gauge amplifiers ? precision integrators ? battery-powered instruments ? test equipment product family device package opa171 sot553, sot23-5, so-8 opa2171 (dual) vssop-8, so-8, msop-8 opa4171 (quad) tssop-14, so-14 smallest packaging for 36v op amps 1 please be aware that an important notice concerning availability, standard warranty, and use in critical applications of texas instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. 2 all trademarks are the property of their respective owners. production data information is current as of publication date. copyright ? 2010 C 2011, texas instruments incorporated products conform to specifications per the terms of the texas instruments standard warranty. production processing does not necessarily include testing of all parameters. package footprint comparison (to scale) package height (to scale) comparison d (so-8) dbv (sot23-5) drl (sot553)
opa171 opa2171 opa4171 sbos516c C september 2010 C revised june 2011 www.ti.com this integrated circuit can be damaged by esd. texas instruments recommends that all integrated circuits be handled with appropriate precautions. failure to observe proper handling and installation procedures can cause damage. esd damage can range from subtle performance degradation to complete device failure. precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. package/ordering information (1) package package transport media, product package-lead designator marking ordering number quantity opa171aidrlt tape and reel, 250 sot553 drl dap opa171aidrlr tape and reel, 4000 opa171aidbvt tape and reel, 250 opa171 sot23-5 dbv osui OPA171AIDBVR tape and reel, 3000 opa171aid rail, 75 so-8 d o171a opa171aidr tape and reel, 2500 opa2171aidgk rail, 80 msop-8 dgk opmi opa2171aidgkr tape and reel, 2500 opa2171aidcut tape and reel, 250 opa2171 vssop-8 dcu opoc opa2171aidcur tape and reel, 3000 opa2171aid rail, 75 so-8 d 2171a opa2171aidr tape and reel, 2500 opa4171aid rail, 50 so-14 d opa4171 opa4171aidr tape and reel, 2500 opa4171 opa4171aipw rail, 90 tssop-14 pw opa4171 opa4171aipwr tape and reel, 2000 (1) for the most current package and ordering information, see the package option addendum at the end of this document, or visit the device product folder at www.ti.com . absolute maximum ratings (1) over operating free-air temperature range, unless otherwise noted. opax171 unit supply voltage 20 v voltage (v C ) C 0.5 to (v+) + 0.5 v signal input terminals current 10 ma output short circuit (2) continuous operating temperature C 55 to +150 c storage temperature C 65 to +150 c junction temperature +150 c human body model (hbm) 4 kv esd ratings: charged device model (cdm) 750 v (1) stresses above these ratings may cause permanent damage. exposure to absolute maximum conditions for extended periods may degrade device reliability. these are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. (2) short-circuit to ground, one amplifier per package. 2 copyright ? 2010 C 2011, texas instruments incorporated
opa171 opa2171 opa4171 www.ti.com sbos516c C september 2010 C revised june 2011 electrical characteristics boldface limits apply over the specified temperature range, t a = C 40 c to +125 c. at t a = +25 c, v s = +2.7v to +36v, v cm = v out = v s /2, and r load = 10k connected to v s /2, unless otherwise noted. opa171, opa2171, opa4171 parameter test conditions min typ max unit offset voltage input offset voltage v os 0.25 1.8 mv over temperature 0.3 2 mv drift dv os /dt 0.3 2 v/ c vs power supply psrr v s = +4v to +36v 1 3 v/v channel separation, dc dc 5 v/v input bias current input bias current i b 8 15 pa over temperature 3.5 na input offset current i os 4 pa over temperature 3.5 na noise input voltage noise f = 0.1hz to 10hz 3 v pp f = 100hz 25 nv/ hz input voltage noise density e n f = 1khz 14 nv/ hz input voltage common-mode voltage range (1) v cm (v C ) C 0.1v (v+) C 2v v v s = 2v, (v C ) C 0.1v < v cm < (v+) C 2v 90 104 db common-mode rejection ratio cmrr v s = 18v, (v C ) C 0.1v < v cm < (v+) C 2v 104 120 db input impedance differential 100 || 3 m || pf 10 12 || common-mode 6 || 3 pf open-loop gain open-loop voltage gain a ol v s = +4v to +36v, (v C ) + 0.35v < v o < (v+) C 0.35v 110 130 db frequency response gain bandwidth product gbp 3.0 mhz slew rate sr g = +1 1.5 v/ s to 0.1%, v s = 18v, g = +1, 10v step 6 s settling time t s to 0.01% (12 bit), v s = 18v, g = +1, 10v step 10 s overload recovery time v in gain > v s 2 s total harmonic distortion + noise thd+n g = +1, f = 1khz, v o = 3v rms 0.0002 % output voltage output swing from rail v o v s = 5v, r l = 10k 30 mv over temperature r l = 10k , a ol 110db (v C ) + 0.35 (v+) C 0.35 v short-circuit current i sc +25/ C 35 ma capacitive load drive c load see typical characteristics pf open-loop output resistance r o f = 1mhz, i o = 0a 150 power supply specified voltage range v s +2.7 +36 v quiescent current per amplifier i q i o = 0a 475 595 a over temperature i o = 0a 650 a temperature specified range C 40 +125 c operating range C 55 +150 c (1) the input range can be extended beyond (v+) C 2v up to v+. see the typical characteristics and application information sections for additional information. copyright ? 2010 C 2011, texas instruments incorporated 3
opa171 opa2171 opa4171 sbos516c C september 2010 C revised june 2011 www.ti.com thermal information: opa171 opa171 thermal metric (1) d (so) dbv (sot23) drl (sot553) units 8 pins 5 pins 5 pins ja junction-to-ambient thermal resistance 149.5 245.8 208.1 jc(top) junction-to-case(top) thermal resistance 97.9 133.9 0.1 jb junction-to-board thermal resistance 87.7 83.6 42.4 c/w jt junction-to-top characterization parameter 35.5 18.2 0.5 jb junction-to-board characterization parameter 89.5 83.1 42.2 jc(bottom) junction-to-case(bottom) thermal resistance n/a n/a n/a (1) for more information about traditional and new thermal metrics, see the ic package thermal metrics application report, spra953 . thermal information: opa2171 opa2171 thermal metric (1) d (so) dcu (vssop) dgk (msop) units 8 pins 8 pins 8 pins ja junction-to-ambient thermal resistance 134.3 175.2 195.3 jc(top) junction-to-case(top) thermal resistance 72.1 74.9 59.4 jb junction-to-board thermal resistance 60.6 22.2 115.1 c/w jt junction-to-top characterization parameter 18.2 1.6 4.7 jb junction-to-board characterization parameter 53.8 22.8 114.4 jc(bottom) junction-to-case(bottom) thermal resistance n/a n/a n/a (1) for more information about traditional and new thermal metrics, see the ic package thermal metrics application report, spra953 . thermal information: opa4171 opa4171 thermal metric (1) d (so) pw (tssop) units 14 pins 14 pins ja junction-to-ambient thermal resistance 93.2 106.9 jc(top) junction-to-case(top) thermal resistance 51.8 24.4 jb junction-to-board thermal resistance 49.4 59.3 c/w jt junction-to-top characterization parameter 13.5 0.6 jb junction-to-board characterization parameter 42.2 54.3 jc(bottom) junction-to-case(bottom) thermal resistance n/a n/a (1) for more information about traditional and new thermal metrics, see the ic package thermal metrics application report, spra953 . 4 copyright ? 2010 C 2011, texas instruments incorporated
opa171 opa2171 opa4171 www.ti.com sbos516c C september 2010 C revised june 2011 pin configurations drl package: opa171 d, dcu, and dgk packages: opa2171 sot-553 so-8, vssop-8, and msop-8 (top view) (top view) dbv package: opa171 sot23-5 (top view) d and pw packages: opa4171 so-14 and tssop-14 (top view) d package: opa171 so-8 (top view) (1) no internal connection. copyright ? 2010 C 2011, texas instruments incorporated 5 12 3 54 v+out in+ v - in - 12 3 4 87 6 5 v+out b - in b +in b out a - in a +in a v - 12 3 4 1413 12 11 out d- in d +in d v - out a - in a +in a v+ 56 7 10 98 +in c- in c out c +in b - in b out b 12 3 54 v+- in out v - +in 12 3 4 87 6 5 nc (1) v+ out nc (1) nc (1) - in +in v -
opa171 opa2171 opa4171 sbos516c C september 2010 C revised june 2011 www.ti.com typical characteristics table of graphs table 1. characteristic performance measurements description figure offset voltage production distribution figure 1 offset voltage drift distribution figure 2 offset voltage vs temperature figure 3 offset voltage vs common-mode voltage figure 4 offset voltage vs common-mode voltage (upper stage) figure 5 offset voltage vs power supply figure 6 i b and i os vs common-mode voltage figure 7 input bias current vs temperature figure 8 output voltage swing vs output current (maximum supply) figure 9 cmrr and psrr vs frequency (referred-to input) figure 10 cmrr vs temperature figure 11 psrr vs temperature figure 12 0.1hz to 10hz noise figure 13 input voltage noise spectral density vs frequency figure 14 thd+n ratio vs frequency figure 15 thd+n vs output amplitude figure 16 quiescent current vs temperature figure 17 quiescent current vs supply voltage figure 18 open-loop gain and phase vs frequency figure 19 closed-loop gain vs frequency figure 20 open-loop gain vs temperature figure 21 open-loop output impedance vs frequency figure 22 small-signal overshoot vs capacitive load (100mv output step) figure 23 , figure 24 no phase reversal figure 25 positive overload recovery figure 26 negative overload recovery figure 27 small-signal step response (100mv) figure 28 , figure 29 large-signal step response figure 30 , figure 31 large-signal settling time (10v positive step) figure 32 large-signal settling time (10v negative step) figure 33 short-circuit current vs temperature figure 34 maximum output voltage vs frequency figure 35 channel separation vs frequency figure 36 6 copyright ? 2010 C 2011, texas instruments incorporated
opa171 opa2171 opa4171 www.ti.com sbos516c C september 2010 C revised june 2011 typical characteristics v s = 18v, v cm = v s /2, r load = 10k connected to v s /2, and c l = 100pf, unless otherwise noted. offset voltage production distribution offset voltage drift distribution figure 1. figure 2. offset voltage vs temperature offset voltage vs common-mode voltage figure 3. figure 4. offset voltage vs common-mode voltage (upper stage) offset voltage vs power supply figure 5. figure 6. copyright ? 2010 C 2011, texas instruments incorporated 7 600400 200 0 200400 600 800 -- - - offset voltage ( v) m - 75 - 50 - 25 0 25 150 temperature ( c) 50 125 100 75 5 typical units shown 1000 800600 400 200 0 200400 600 800 1000 -- - - - v ( v) m os - 20 - 15 - 10 - 5 0 5 10 15 20 v (v) cm v = 18.1v - cm 10 typical units shown 10000 80006000 4000 2000 0 20004000 6000 8000 10000 -- - - - v ( v) m os 15.5 16 16.5 17 17.5 18 18.5 v (v) cm 10 typical units shown normal operation v = +18.1v cm 350250 150 5050 150250 350 - -- - v ( v) m os 0 2 4 6 8 16 20 v (v) supply v = 1.35v to 18v 10 typical units shown supply 18 14 12 10 0 0.10.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.11.2 1.3 2 offset voltage drift ( v/ c) m percentage of amplifiers (%) 2520 15 10 50 1 distribution taken from 110 amplifiers 1.5 1.7 1.9 1.8 1.6 1.4 - 1200 - 1100 - 1000 - 900 - 800 - 700 - 600 - 500 - 400 - 300 - 100 0 100200 300 400 500 600 700 800 900 1000 1200 offset voltage ( v) m percentage of amplifiers (%) 1614 12 10 86 4 2 0 - 200 1100 distribution taken from 3500 amplifiers
opa171 opa2171 opa4171 sbos516c C september 2010 C revised june 2011 www.ti.com typical characteristics (continued) v s = 18v, v cm = v s /2, r load = 10k connected to v s /2, and c l = 100pf, unless otherwise noted. i b and i os vs common-mode voltage input bias current vs temperature figure 7. figure 8. output voltage swing vs output current cmrr and psrr vs frequency (maximum supply) (referred-to input) figure 9. figure 10. cmrr vs temperature psrr vs temperature figure 11. figure 12. 8 copyright ? 2010 C 2011, texas instruments incorporated 1514 13 12 11 10 98 7 6 5 4 3 2 1 0 i and i (pa) b os - 20 - 12 - 6 0 6 20 v (v) cm 12 - i b +i b - i os - 18 18 v = 18.1v - cm v = 16v cm i b+ i b - i os 10000 1000 100 10 10 input bias current (pa) - 75 - 50 - 25 0 25 150 temperature ( c) 50 125 100 75 i b i os 18 output voltage (v) 0 2 4 6 8 16 output current (ma) 10 12 14 1716 15 14.5 - 14.5 - 15 - 16 - 17 - 18 - 40 c +25 c +85 c +125 c 140120 100 8060 40 20 0 common-mode rejection ratio (db), power-supply rejection ratio (db) 1 10 100 1k 10k 10m frequency (hz) 100k 1m +psrr - psrr cmrr 3020 10 0 1020 30 -- - common-mode rejection ratio ( v/v) m - 75 - 50 - 25 0 25 150 temperature ( c) 50 125 100 75 v = 2.7v s v = 4v s v = 36v s 32 1 0 1 2 3 -- - power-supply rejection ratio ( v/v) m - 75 - 50 - 25 0 25 150 temperature ( c) 50 125 100 75 v = 2.7v to 36v s v = 4v to 36v s
opa171 opa2171 opa4171 www.ti.com sbos516c C september 2010 C revised june 2011 typical characteristics (continued) v s = 18v, v cm = v s /2, r load = 10k connected to v s /2, and c l = 100pf, unless otherwise noted. input voltage noise spectral density vs 0.1hz to 10hz noise frequency figure 13. figure 14. thd+n ratio vs frequency thd+n vs output amplitude figure 15. figure 16. quiescent current vs temperature quiescent current vs supply voltage figure 17. figure 18. copyright ? 2010 C 2011, texas instruments incorporated 9 1000 100 10 1 voltage noise density (nv/ ) ? hz 1 10 100 1k 10k 1m frequency (hz) 100k 0.01 0.001 0.0001 0.00001 total harmonic distortion + noise (%) 10 100 1k 10k 20k frequency (hz) total harmonic distortion + noise (db) v = 3v bw = 80khz out rms g = +1, r = 10k w l g = 1, r = 2k - w l - 80 - 100 - 120 - 140 0.1 0.01 0.001 0.0001 0.00001 total harmonic distortion + noise (%) 0.01 0.1 1 10 20 output amplitude (v ) rms - 80 total harmonic distortion + noise (db) bw = 80khz g = +1, r = 10k w l g = 1, r = 2k - w l - 100 - 120 - 140 0.65 0.6 0.55 0.5 0.45 0.4 0.35 i (ma) q - 75 - 50 - 25 0 25 150 temperature ( c) 125 100 75 50 0.6 0.55 0.5 0.45 0.4 0.35 0.3 0.25 i (ma) q 0 4 8 12 16 36 supply voltage (v) 32 28 24 20 specified supply-voltage range 1 v/div m time (1s/div)
opa171 opa2171 opa4171 sbos516c C september 2010 C revised june 2011 www.ti.com typical characteristics (continued) v s = 18v, v cm = v s /2, r load = 10k connected to v s /2, and c l = 100pf, unless otherwise noted. open-loop gain and phase vs frequency closed-loop gain vs frequency figure 19. figure 20. open-loop gain vs temperature open-loop output impedance vs frequency figure 21. figure 22. small-signal overshoot vs capacitive load small-signal overshoot vs capacitive load (100mv output step) (100mv output step) figure 23. figure 24. 10 copyright ? 2010 C 2011, texas instruments incorporated 180135 9045 0 45 - gain (db) 1 10 100 1k 10k 10m frequency (hz) 1m 100k phase gain phase ( ) 180135 90 45 0 - 45 2520 15 10 50 5 1015 20 - -- - gain (db) 10k 100m frequency (hz) 1m 100k 10m g = 10 g = 1 g = 1 - 3 2.5 2 1.5 1 0.5 0 a ( v/v) m ol - 75 150 temperature ( c) - 25 - 50 0 5 typical units shown 125 100 75 50 25 v = 2.7v s v = 4v s v = 36v s 1m 100k 10k 1k 100 10 1 1m z ( ) w o 1 10 100 1k 10k 10m frequency (hz) 100k 1m 5045 40 35 30 25 20 15 10 50 overshoot (%) 0 100 200 300 400 500 600 700 800 900 1000 capacitive load (pf) +18v - 18v r out c l opa171 r l g = +1 r = 0 w out r = 25 w out r = 50 w out r = 10k w l 5045 40 35 30 25 20 15 10 50 overshoot (%) 0 100 200 300 400 500 600 700 800 900 1000 capacitive load (pf) opa171 r = i 10k w r out c l r f = 10k w +18v - 18v g = 1 - r = 0 w out r = 25 w out r = 50 w out
opa171 opa2171 opa4171 www.ti.com sbos516c C september 2010 C revised june 2011 typical characteristics (continued) v s = 18v, v cm = v s /2, r load = 10k connected to v s /2, and c l = 100pf, unless otherwise noted. no phase reversal positive overload recovery figure 25. figure 26. small-signal step response negative overload recovery (100mv) figure 27. figure 28. small-signal step response (100mv) large-signal step response figure 29. figure 30. copyright ? 2010 C 2011, texas instruments incorporated 11 output output time (100 s/div) m 5v/div +18v - 18v 37v pp sine wave ( 18.5v) opa171 time (5 s/div) m 5v/div v in v out 2k w 20k w v in v out opa171 g = 10 - +18v - 18v time (5 s/div) m 5v/div v in v out 2k w 20k w v in v out opa171 g = 10 - +18v - 18v 20mv/div time (1 s/div) m +18v - 18v c l r l opa171 g = +1 r = 10k c = 100pf w ll time (20 s/div) m 20mv/div +18v - 18v r 2k w f = r 2k w i = c l opa171 g = 1 - c = 100pf l 2v/div time (5 s/div) m g = +1 r = 10k c = 100pf w l l
opa171 opa2171 opa4171 sbos516c C september 2010 C revised june 2011 www.ti.com typical characteristics (continued) v s = 18v, v cm = v s /2, r load = 10k connected to v s /2, and c l = 100pf, unless otherwise noted. large-signal settling time large-signal step response (10v positive step) figure 31. figure 32. large-signal settling time (10v negative step) short-circuit current vs temperature figure 33. figure 34. maximum output voltage vs frequency channel separation vs frequency figure 35. figure 36. 12 copyright ? 2010 C 2011, texas instruments incorporated - 6070 80 90 100110 120 -- - -- - channel separation (db) 10 100 1k 10k 100k frequency (hz) time (4 s/div) m 2v/div g = 1 r = 10k c = 100pf - w ll 10 86 4 2 0 2 4 6 8 10 -- - - - d from final value (mv) 0 36 time ( s) m 8 4 28 32 24 20 16 12 12-bit settling ( 1/2lsb = 0.024%) g = 1 - 10 86 4 2 0 2 4 6 8 10 -- - - - d from final value (mv) 0 36 time ( s) m 8 4 28 32 24 20 16 12 12-bit settling ( 1/2lsb = 0.024%) g = 1 - 5045 40 35 30 25 20 15 10 50 i (ma) sc - 75 - 50 - 25 0 25 150 temperature ( c) 50 125 i , source sc 100 75 i , sink sc 15 12.5 10 7.5 5 2.5 0 output voltage (v ) pp 10k 100k 1m 10m frequency (hz) v = 15v s v = 5v s v = 1.35v s maximum output voltage withoutslew-rate induced distortion.
opa171 opa2171 opa4171 www.ti.com sbos516c C september 2010 C revised june 2011 application information the opax171 family of operational amplifiers provide this device can operate with full rail-to-rail input high overall performance, making them ideal for many 100mv beyond the top rail, but with reduced general-purpose applications. the excellent offset performance within 2v of the top rail. the typical drift of only 2 v/ c provides excellent stability over performance in this range is summarized in table 2 . the entire temperature range. in addition, the device offers very good overall performance with high phase-reversal protection cmrr, psrr, and a ol . as with all amplifiers, the opax171 family has an internal phase-reversal applications with noisy or high-impedance power protection. many op amps exhibit a phase reversal supplies require decoupling capacitors close to the when the input is driven beyond its linear device pins. in most cases, 0.1 f capacitors are common-mode range. this condition is most often adequate. encountered in noninverting circuits when the input is driven beyond the specified common-mode voltage operating characteristics range, causing the output to reverse into the opposite the opax171 family of amplifiers is specified for rail. the input of the opax171 prevents phase operation from 2.7v to 36v ( 1.35v to 18v). many reversal with excessive common-mode voltage. of the specifications apply from C 40 c to +125 c. instead, the output limits into the appropriate rail. this parameters that can exhibit significant variance with performance is shown in figure 37 . regard to operating voltage or temperature are presented in the typical characteristics . general layout guidelines for best operational performance of the device, good printed circuit board (pcb) layout practices are recommended. low-loss, 0.1 f bypass capacitors should be connected between each supply pin and ground, placed as close to the device as possible. a single bypass capacitor from v+ to ground is applicable to single-supply applications. common-mode voltage range the input common-mode voltage range of the figure 37. no phase reversal opax171 series extends 100mv below the negative rail and within 2v of the top rail for normal operation. table 2. typical performance range parameter min typ max unit input common-mode voltage (v+) C 2 (v+) + 0.1 v offset voltage 7 mv vs temperature 12 v/ c common-mode rejection 65 db open-loop gain 60 db gbw 0.7 mhz slew rate 0.7 v/ s noise at f = 1khz 30 nv/ hz copyright ? 2010 C 2011, texas instruments incorporated 13 output output time (100 s/div) m 5v/div +18v - 18v 37v pp sine wave ( 18.5v) opa171
opa171 opa2171 opa4171 sbos516c C september 2010 C revised june 2011 www.ti.com capacitive load and stability or even the output pin. each of these different pin functions have electrical stress limits determined by the dynamic characteristics of the opax171 have the voltage breakdown characteristics of the been optimized for commonly encountered operating particular semiconductor fabrication process and conditions. the combination of low closed-loop gain specific circuits connected to the pin. additionally, and high capacitive loads decreases the phase internal electrostatic discharge (esd) protection is margin of the amplifier and can lead to gain peaking built into these circuits to protect them from or oscillations. as a result, heavier capacitive loads accidental esd events both before and during must be isolated from the output. the simplest way to product assembly. achieve this isolation is to add a small resistor (for example, r out equal to 50 ) in series with the these esd protection diodes also provide in-circuit, output. figure 38 and figure 39 illustrate graphs of input overdrive protection, as long as the current is small-signal overshoot versus capacitive load for limited to 10ma as stated in the absolute maximum several values of r out . also, refer to applications ratings . figure 40 shows how a series input resistor bulletin ab-028 ( sboa015 ) , available for download may be added to the driven input to limit the input from the ti website for details of analysis techniques current. the added resistor contributes thermal noise and application circuits. at the amplifier input and its value should be kept to a minimum in noise-sensitive applications. figure 40. input current protection an esd event produces a short duration, high-voltage pulse that is transformed into a short duration, high-current pulse as it discharges through a semiconductor device. the esd protection circuits figure 38. small-signal overshoot versus are designed to provide a current path around the capacitive load (100mv output step) operational amplifier core to prevent it from being damaged. the energy absorbed by the protection circuitry is then dissipated as heat. when the operational amplifier connects into a circuit, the esd protection components are intended to remain inactive and not become involved in the application circuit operation. however, circumstances may arise where an applied voltage exceeds the operating voltage range of a given pin. should this condition occur, there is a risk that some of the internal esd protection circuits may be biased on, and conduct current. any such current flow occurs through esd cells and rarely involves the absorption device. if there is an uncertainty about the ability of the supply to absorb this current, external zener diodes may be added to the supply pins. the zener voltage figure 39. small-signal overshoot versus must be selected such that the diode does not turn capacitive load (100mv output step) on during normal operation. electrical overstress however, its zener voltage should be low enough so that the zener diode conducts if the supply pin begins designers often ask questions about the capability of to rise above the safe operating supply voltage level. an operational amplifier to withstand electrical overstress. these questions tend to focus on the device inputs, but may involve the supply voltage pins 14 copyright ? 2010 C 2011, texas instruments incorporated 5k w opa171 10ma max v+ v in v out i overload 5045 40 35 30 25 20 15 10 50 overshoot (%) 0 100 200 300 400 500 600 700 800 900 1000 capacitive load (pf) +18v - 18v r out c l opa171 r l g = +1 r = 0 w out r = 25 w out r = 50 w out r = 10k w l 5045 40 35 30 25 20 15 10 50 overshoot (%) 0 100 200 300 400 500 600 700 800 900 1000 capacitive load (pf) opa171 r = i 10k w r out c l r f = 10k w +18v - 18v g = 1 - r = 0 w out r = 25 w out r = 50 w out
opa171 opa2171 opa4171 www.ti.com sbos516c C september 2010 C revised june 2011 revision history note: page numbers for previous revisions may differ from page numbers in the current version. changes from revision b (november 2010) to revision c page ? added msop-8 package to device graphic .......................................................................................................................... 1 ? added msop-8 package to features bullets ....................................................................................................................... 1 ? added msop-8 package to product family table ................................................................................................................ 1 ? added msop-8 package to package/ordering information table ........................................................................................ 2 ? deleted " a " suffix from opa4171 package markings in package/ordering information table. ............................................ 2 ? added new row for voltage output swing from rail parameter to output subsection of electrical characteristics ............ 3 ? changed voltage output swing from rail parameter to over temperature in output subsection of electrical characteristics ...................................................................................................................................................................... 3 ? updated format of thermal information tables ...................................................................................................................... 4 ? added msop-8 package to opa2171 thermal information table ....................................................................................... 4 ? updated pinout configurations for opa2171 and opa4171 ................................................................................................ 5 ? changed figure 9 ................................................................................................................................................................. 8 changes from revision a (november, 2010) to revision b page ? changed input offset voltage specification ........................................................................................................................... 3 ? changed input offset voltage, over temperature specification .............................................................................................. 3 ? changed quiescent current per amplifier, over temperature specification ........................................................................... 3 copyright ? 2010 C 2011, texas instruments incorporated 15
package option addendum www.ti.com 5-sep-2011 addendum-page 1 packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ ball finish msl peak temp (3) samples (requires login) opa171aid active soic d 8 75 green (rohs & no sb/br) cu nipdau level-2-260c-1 year OPA171AIDBVR active sot-23 dbv 5 3000 green (rohs & no sb/br) cu nipdau level-2-260c-1 year opa171aidbvt active sot-23 dbv 5 250 green (rohs & no sb/br) cu nipdau level-2-260c-1 year opa171aidr active soic d 8 2500 green (rohs & no sb/br) cu nipdau level-2-260c-1 year opa171aidrlr active sot drl 5 4000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim opa171aidrlt active sot drl 5 250 green (rohs & no sb/br) cu nipdau level-1-260c-unlim opa2171aid active soic d 8 75 green (rohs & no sb/br) cu nipdau level-2-260c-1 year opa2171aidcur active us8 dcu 8 3000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim opa2171aidcut active us8 dcu 8 250 green (rohs & no sb/br) cu nipdau level-1-260c-unlim opa2171aidgk preview msop dgk 8 80 green (rohs & no sb/br) cu nipdau level-2-260c-1 year opa2171aidgkr preview msop dgk 8 2500 green (rohs & no sb/br) cu nipdau level-2-260c-1 year opa2171aidr active soic d 8 2500 green (rohs & no sb/br) cu nipdau level-2-260c-1 year opa4171aid active soic d 14 50 green (rohs & no sb/br) cu nipdau level-3-260c-168 hr opa4171aidr active soic d 14 2500 green (rohs & no sb/br) cu nipdau level-3-260c-168 hr opa4171aipw preview tssop pw 14 green (rohs & no sb/br) cu nipdau level-2-260c-1 year opa4171aipwr preview tssop pw 14 green (rohs & no sb/br) cu nipdau level-2-260c-1 year (1) the marketing status values are defined as follows:
package option addendum www.ti.com 5-sep-2011 addendum-page 2 active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis. other qualified versions of opa171 : ? automotive: opa171-q1 note: qualified version definitions: ? automotive - q100 devices qualified for high-reliability automotive applications targeting zero defects
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant OPA171AIDBVR sot-23 dbv 5 3000 180.0 8.4 3.23 3.17 1.37 4.0 8.0 q3 opa171aidbvt sot-23 dbv 5 250 180.0 8.4 3.23 3.17 1.37 4.0 8.0 q3 opa171aidr soic d 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 q1 opa171aidrlr sot drl 5 4000 180.0 8.4 1.98 1.78 0.69 4.0 8.0 q3 opa171aidrlt sot drl 5 250 180.0 8.4 1.98 1.78 0.69 4.0 8.0 q3 opa2171aidcur us8 dcu 8 3000 180.0 8.4 2.25 3.35 1.05 4.0 8.0 q3 opa2171aidcut us8 dcu 8 250 180.0 8.4 2.25 3.35 1.05 4.0 8.0 q3 opa2171aidr soic d 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 q1 opa4171aidr soic d 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 q1 package materials information www.ti.com 18-aug-2011 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) OPA171AIDBVR sot-23 dbv 5 3000 202.0 201.0 28.0 opa171aidbvt sot-23 dbv 5 250 202.0 201.0 28.0 opa171aidr soic d 8 2500 346.0 346.0 29.0 opa171aidrlr sot drl 5 4000 202.0 201.0 28.0 opa171aidrlt sot drl 5 250 202.0 201.0 28.0 opa2171aidcur us8 dcu 8 3000 202.0 201.0 28.0 opa2171aidcut us8 dcu 8 250 202.0 201.0 28.0 opa2171aidr soic d 8 2500 346.0 346.0 29.0 opa4171aidr soic d 14 2500 346.0 346.0 33.0 package materials information www.ti.com 18-aug-2011 pack materials-page 2

important notice texas instruments incorporated and its subsidiaries (ti) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. all products are sold subject to ti s terms and conditions of sale supplied at the time of order acknowledgment. ti warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with ti s standard warranty. testing and other quality control techniques are used to the extent ti deems necessary to support this warranty. except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. ti assumes no liability for applications assistance or customer product design. customers are responsible for their products and applications using ti components. to minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. ti does not warrant or represent that any license, either express or implied, is granted under any ti patent right, copyright, mask work right, or other ti intellectual property right relating to any combination, machine, or process in which ti products or services are used. information published by ti regarding third-party products or services does not constitute a license from ti to use such products or services or a warranty or endorsement thereof. use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from ti under the patents or other intellectual property of ti. reproduction of ti information in ti data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. reproduction of this information with alteration is an unfair and deceptive business practice. ti is not responsible or liable for such altered documentation. information of third parties may be subject to additional restrictions. resale of ti products or services with statements different from or beyond the parameters stated by ti for that product or service voids all express and any implied warranties for the associated ti product or service and is an unfair and deceptive business practice. ti is not responsible or liable for any such statements. ti products are not authorized for use in safety-critical applications (such as life support) where a failure of the ti product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of ti products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by ti. further, buyers must fully indemnify ti and its representatives against any damages arising out of the use of ti products in such safety-critical applications. ti products are neither designed nor intended for use in military/aerospace applications or environments unless the ti products are specifically designated by ti as military-grade or " enhanced plastic. " only products designated by ti as military-grade meet military specifications. buyers acknowledge and agree that any such use of ti products which ti has not designated as military-grade is solely at the buyer ' s risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. ti products are neither designed nor intended for use in automotive applications or environments unless the specific ti products are designated by ti as compliant with iso/ts 16949 requirements. buyers acknowledge and agree that, if they use any non-designated products in automotive applications, ti will not be responsible for any failure to meet such requirements. following are urls where you can obtain information on other texas instruments products and application solutions: products applications audio www.ti.com/audio communications and telecom www.ti.com/communications amplifiers amplifier.ti.com computers and peripherals www.ti.com/computers data converters dataconverter.ti.com consumer electronics www.ti.com/consumer-apps dlp ? products www.dlp.com energy and lighting www.ti.com/energy dsp dsp.ti.com industrial www.ti.com/industrial clocks and timers www.ti.com/clocks medical www.ti.com/medical interface interface.ti.com security www.ti.com/security logic logic.ti.com space, avionics and defense www.ti.com/space-avionics-defense power mgmt power.ti.com transportation and automotive www.ti.com/automotive microcontrollers microcontroller.ti.com video and imaging www.ti.com/video rfid www.ti-rfid.com omap mobile processors www.ti.com/omap wireless connctivity www.ti.com/wirelessconnectivity ti e2e community home page e2e.ti.com mailing address: texas instruments, post office box 655303, dallas, texas 75265 copyright ? 2011, texas instruments incorporated

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